SIMcom Launches Modules at Mobile World Congress
SIMCom Wireless Solutions Ltd. of Shanghai launched its first compact LGA 2G module SIM900E at Mobile World Congress 2013 today. The module’s small size and LGA encapsulation suit M2M applications of all sizes, especially satisfying requirements for slim, compact design, SIMcom said. The Mobile World Congress is being held in Barcelona, Spain, this week. With operations from 2002 to 2013,... read more
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