Telit, a global enabler of the Internet of Things (IoT), has introduced advanced positioning modules in the SE868xx-Ax family featuring multi-constellation GNSS receivers with 9 square millimeter patch antennas.
Telit’s SE868Kx-Ax series offers high performance for space-constrained applications such as wearables, tracking, telematics and security. The new integrated antenna modules include advanced features that significantly increase RF sensitivity, allowing for a much simpler integration without external components.
The SE868K3-A/AL is a multi-constellation GNSS variant with flash memory and a GNSS core.
The SE868K7-A/AL is a GPS variant with ROM memory and a GPS core.
The new module variants are designed with the same, ultra-compact 11 square millimeter cavity PCB package as the other modules in the series, with the bonus of a second low noise amplifier (LNA) and surface acoustic wave (SAW) filter. Footprint compatible with other modules in the family, the SE868Kx-Ax series includes variants with multiple interfaces and a combination of features including:
- Ultra-compact 11 x 11 mm “cavity” PCB package
- Standard variant with integrated 9 millimeter by 9 millimeter by 4 millimeter SMT antenna
- Low-profile variant with 9 millimeter by 9 millimeter by 2 millimeter antenna
- Additional LNA and SAW filter
- Real time clock (RTC) and temperature compensated crystal oscillator (TCXO)
- Jamming rejection
- Pin-to-pin compatibility with other modules in the series
- Ephemeris file injection (A-GPS)
- Satellite-Based Augmentation System (SBAS) compliant
With the different options available in the SE868Kx-Ax series, customers can design once and interchangeably mount the solution most appropriate for the environment, Telit said. This enables developers to select the right technology for their use case without having to redesign the entire application when it comes time to transition.
“The SE868Kx-Ax series is an exciting enhancement to our positioning product portfolio,” said Felix Marchal, EVP GNSS and short range, Telit. “Our commitment to excellence is reflected in the years of experience releasing breakthrough positioning modules and solutions. This latest release specifically addresses the integration challenges that IoT developers face today. Leveraging the low-profile and SMT mounting options that do not compromise the host PCB, developers can take advantage of the most important and advanced features available in positioning technology tangibly booting the efficiency of global design efforts, schedules and budgets.”
The Telit IoT Know How program assists customers to accelerate the deployment of cost-effective and future-proof solutions integrated with GNSS from idea to market, the company said.
The variants will be available in the second quarter of 2017. Telit is exhibiting them at Embedded World 2017, Nuremberg, Germany, March 14-16, located at hall 3, booth 3-518.