SIMcom Launches Modules at Mobile World Congress

SIMCom Wireless Solutions Ltd. of Shanghai launched its first compact LGA 2G module SIM900E at Mobile World Congress 2013 today. The module’s small size and LGA encapsulation suit M2M applications of all sizes, especially satisfying requirements for slim, compact design, SIMcom said. The Mobile World Congress is being held in Barcelona, Spain, this week.

With operations from 2002 to 2013, SIMCom has just celebrated its 10th anniversary. The company has developed into a global leader of wireless solutions with the integration of R&D, production, sales and after-sales services, and with products covering technologies such as GPS, GLONASS, GSM/GPRS, WCDMA/HSPA, TD-SCDMA, CDMA EVDO, SRD, and Wi-Fi. The products have been sold in more than 100 countries and regions, involving almost all M2M industries. With the celebration of its 10th anniversary, SIMCom also launched its first company magazine, SIMCom Inside.

SIMCom launched its module series of 2G/3G, with the same size of 30 x 30 millimeters, including SIM928, SIM968, SIM5310 and more. Integrated with GSM/GPRS and GPS, the SIM928 module is a compact quad-Band GSM/GPRS-enabled module based on the PNX4851 platform. SIM968 is a combo module featuring quad-band GSM/GPRS and combining GLONASS technology for satellite navigation. SIM5310 is a low-cost 3G module that supports WCDMA 384Kbps and single frequency band 2100 MHz. In addition, SIMCom will also introduce the first LTE intelligent module SIM7290.

The compact module SIM900E released today has an LGA encapsulation of 19.8 x 19.8 x 2.7 millimeters, and its LGA encapsulation is suitable for automatic assembly with SMT equipment, the company said. The configuration of four frequencies of GSM/GPRS — 850/900/1800/1900MHz — and wide temperature range of -40C to +85C is designed for global seamless coverage and various industrial application environments.