Broadcom Introduces Femtocell Chip to Integrate RF and Baseband Modem

February 26, 2013  - By

Broadcom Corporation introduced at the Mobile World Congress a highly integrated digital baseband processor and RF transceiver designed for 3G femtocell residential access points, the BCM61630 systems on chip. The Mobile World Congress is being held in Barcelona, Spain, this week.

The new devices integrate a multiband CMOS RF transceiver with GPS and full-time sniffing capability while maintaining software compatibility with all previous Broadcom WCDMA physical layer and backhauling interface architectures.

With the new chips, mobile operator OEMs and ODMs have a powerful, low-cost, power efficient device to support small cell strategies and meet growing mobile traffic demands. Embedding a high-speed CPU and Broadcom’s Layer 1 modem and peripherals, these devices provide a complete low-power single-chip solution for residential and small enterprise 3G small cell deployments, the company said.

“As on-the-go content consumption continues to drive traffic growth, mobile operators must meet consumers’ increasing demand for higher bandwidth without sacrificing quality of service,” said Greg Fischer, Broadcom’s vice president and general manager for Broadband Carrier Access. “Broadcom’s BCM61630 SoCs deliver a low-power, cost-efficient device for residential small cells to leverage existing mobile infrastructure and deliver faster data speeds through a smaller form factor.”

This article is tagged with and posted in OEM News, Product Showcase, Wireless Infrastructure
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